• DocumentCode
    3345812
  • Title

    Decision-Support Models for Thermo-Mechanical Reliability of Leadfree Flip-Chip Electronics in Extreme Environments

  • Author

    Lall, Pradeep ; Singh, Naveen ; Strickland, Mark ; Blanche, Jim ; Suhling, Jeff

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    127
  • Lastpage
    136
  • Keywords
    Aerospace electronics; Components, packaging, and manufacturing technology; Electronic packaging thermal management; Electronics packaging; Flip chip; Geometry; Materials reliability; Predictive models; Product design; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441257
  • Filename
    1441257
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3345812