DocumentCode :
3345910
Title :
Multi-Physics Based Structural Similarity Rules for the BGA Package Family
Author :
van Driel, W.D. ; Mavinkurve, A. ; van Gils, M.A.J. ; Zhang, G.Q. ; Yang, D.G. ; Ernst, L.J.
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
165
Lastpage :
171
Keywords :
Costs; Fabrication; Integrated circuit packaging; Integrated circuit reliability; Lead; Physics; Process design; Qualifications; Semiconductor device packaging; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441262
Filename :
1441262
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3345910
بازگشت