Whisker formation on matte Sn influencing of high humidity

Author

Oberndorff, P. ; Dittes, M. ; Crema, P. ; Chopin, S.

Author_Institution

Philips Appl. Technol., Eindhoven, Netherlands

fYear

2005

fDate

31 May-3 June 2005

Firstpage

429

Abstract

The purpose of this study was to identify the main causes for whisker growth and to establish its mechanism, while at the same time identifying test conditions that can be used for an industry wide acceptance test for whisker formation, since this test has never been established. In order to understand the influence of humidity and corrosion on whisker growth the E4 (Freescale Semiconductor, Infineon, STMicroelectronics and Philips) started an extensive design of experiments (DoE). Parameters in this DoE include: plating, solderpaste, flux, substrate material, preconditioning and condensation. This paper presents the outcome of this DoE and furthermore give an update on the previously reported and ongoing experiments to discover the main factors influencing whisker growth.

Keywords

corrosion; design of experiments; electronics industry; electronics packaging; electroplating; tin; Sn; corrosion effect; design of experiment; humidity effect; substrate material; whisker growth; Corrosion; Humidity; IEC standards; Isothermal processes; Lead; Material storage; Proposals; Semiconductor device testing; Thermal expansion; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

conf

DOI

10.1109/ECTC.2005.1441300

Filename

1441300