Title :
Novel Hermetic Wafer-Level-Packaging Technology using Low-Temperature Passivation
Author :
Leib, Jürgen ; Mund, Dietrich ; Töpper, Michael
fDate :
May 31 2005-June 3 2005
Keywords :
Dielectric materials; Etching; Glass; Packaging; Passivation; Plasma temperature; Polymers; Sealing materials; Silicon; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441323
