DocumentCode :
3347351
Title :
Identification of Mechanical Properties of Intermetallic Compounds on Lead Free Solder
Author :
Tsai, Iting ; Tai, Li Jung ; Yen, S.F. ; Chuang, T.H. ; Lo, Robert ; Ku, Terry ; Wu, Enboa
fYear :
2005
fDate :
31 May-3 June 2005
Firstpage :
687
Lastpage :
691
Keywords :
Copper; Environmentally friendly manufacturing techniques; Intermetallic; Lead compounds; Material properties; Materials science and technology; Mechanical factors; Semiconductor thin films; Silicon; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441343
Filename :
1441343
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3347351
بازگشت