DocumentCode
3347443
Title
Comprehensive Model for On-Chip Power Grid Transient Analysis and Power Grid-Induced Noise Prediction
Author
Ihm, Jae-Yong ; Chung, In Jae ; Manetas, Giorgos ; Cangellaris, Andreas C.
Author_Institution
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
716
Lastpage
721
Abstract
A comprehensive modeling methodology is presented for the switching analysis of the on-chip power grid. Contrary to commonly used techniques, an electromagnetic model is used for the discretization of the volume occupied by the grid. Thus, the tedious and error-prone extraction of a distributed RLC model for the power grid is avoided. In addition, the generated discrete model allows for power grid induced coupling to be taken into account in the transient simulation. The electromagnetic model for the power grid is complemented by a distributed RC model for the semiconductor substrate and RLCG models for the interconnects. Thus, a comprehensive model results for the quantification of on-chip interconnect and power grid noise effects during switching. Transient simulations using this model are carried out using a hybrid time-domain integration scheme which combines a SPICE-like engine for the analysis of the RLCG netlists and the nonlinear drivers, and a numerical integration algorithm for the discrete electromagnetic model for the power grid
Keywords
RLC circuits; SPICE; circuit noise; circuit simulation; computational electromagnetics; integrated circuit modelling; power supply circuits; transient analysis; RLCG netlist; SPICE-like engine; distributed RLC model; electromagnetic model; nonlinear driver; numerical integration algorithm; on-chip interconnect; on-chip power grid; power grid-induced noise prediction; semiconductor substrate; switching analysis; time-domain integration; Electromagnetic modeling; Electromagnetic transients; Mesh generation; Power generation; Power grids; Power semiconductor switches; Predictive models; Semiconductor device noise; Substrates; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441348
Filename
1441348
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