• DocumentCode
    3347443
  • Title

    Comprehensive Model for On-Chip Power Grid Transient Analysis and Power Grid-Induced Noise Prediction

  • Author

    Ihm, Jae-Yong ; Chung, In Jae ; Manetas, Giorgos ; Cangellaris, Andreas C.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL
  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    716
  • Lastpage
    721
  • Abstract
    A comprehensive modeling methodology is presented for the switching analysis of the on-chip power grid. Contrary to commonly used techniques, an electromagnetic model is used for the discretization of the volume occupied by the grid. Thus, the tedious and error-prone extraction of a distributed RLC model for the power grid is avoided. In addition, the generated discrete model allows for power grid induced coupling to be taken into account in the transient simulation. The electromagnetic model for the power grid is complemented by a distributed RC model for the semiconductor substrate and RLCG models for the interconnects. Thus, a comprehensive model results for the quantification of on-chip interconnect and power grid noise effects during switching. Transient simulations using this model are carried out using a hybrid time-domain integration scheme which combines a SPICE-like engine for the analysis of the RLCG netlists and the nonlinear drivers, and a numerical integration algorithm for the discrete electromagnetic model for the power grid
  • Keywords
    RLC circuits; SPICE; circuit noise; circuit simulation; computational electromagnetics; integrated circuit modelling; power supply circuits; transient analysis; RLCG netlist; SPICE-like engine; distributed RLC model; electromagnetic model; nonlinear driver; numerical integration algorithm; on-chip interconnect; on-chip power grid; power grid-induced noise prediction; semiconductor substrate; switching analysis; time-domain integration; Electromagnetic modeling; Electromagnetic transients; Mesh generation; Power generation; Power grids; Power semiconductor switches; Predictive models; Semiconductor device noise; Substrates; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441348
  • Filename
    1441348