DocumentCode :
3347493
Title :
Comparative Study on Effectiveness of On-Chip, On-Package and PCB Decoupling for Core Noise Reduction by Using Broadband
Author :
Mandhana, Om P. ; Zhao, Jin
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
732
Lastpage :
739
Keywords :
Electromagnetic fields; Frequency; Impedance; Integrated circuit noise; Microprocessors; Noise reduction; Packaging; Power system modeling; Printed circuits; Semiconductor device noise;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441351
Filename :
1441351
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3347493
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