• DocumentCode
    3347749
  • Title

    Ultra-High-Speed Signal Propagation of High-Density Wiring Interposer for 3D Packaging

  • Author

    Kikuchi, Katsuya ; Nakagawa, Hiroshi ; Tokoro, Kazuhiko ; Aoyagi, Masahiro ; Segawa, Shigemasa

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    809
  • Lastpage
    813
  • Keywords
    Curing; Dielectric constant; Dielectric loss measurement; Dielectric losses; Dielectric materials; Dielectrics and electrical insulation; Large scale integration; Packaging; Polyimides; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441365
  • Filename
    1441365
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3347749