DocumentCode
3348223
Title
Novel Damage Model for Delamination in Cu/low-k IC Backend Structures
Author
Van Gils, Marcel A J ; van der Sluis, O. ; Zhang, G.Q. ; Janssen, J.H.J. ; Voncken, R.M.J.
fYear
2005
fDate
May 31 2005-June 3 2005
Firstpage
988
Lastpage
994
Keywords
Bonding forces; CMOS technology; Copper; Delamination; Integrated circuit modeling; Materials testing; Packaging; Qualifications; Thermomechanical processes; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1441392
Filename
1441392
Link To Document