Title :
Novel Damage Model for Delamination in Cu/low-k IC Backend Structures
Author :
Van Gils, Marcel A J ; van der Sluis, O. ; Zhang, G.Q. ; Janssen, J.H.J. ; Voncken, R.M.J.
fDate :
May 31 2005-June 3 2005
Keywords :
Bonding forces; CMOS technology; Copper; Delamination; Integrated circuit modeling; Materials testing; Packaging; Qualifications; Thermomechanical processes; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
0-7803-8907-7
DOI :
10.1109/ECTC.2005.1441392
