• DocumentCode
    3348744
  • Title

    Dielectric Integrity Test for Flip-Chip Devices with Cu/Low-k Interconnects

  • Author

    Odegard, Charles ; Chiu, Tz-Cheng ; Hartfield, Cheryl ; Sundararaman, Vish

  • fYear
    2005
  • fDate
    May 31 2005-June 3 2005
  • Firstpage
    1163
  • Lastpage
    1171
  • Keywords
    Assembly; Dielectric devices; Dielectric materials; Dielectric substrates; Packaging; Residual stresses; Semiconductor materials; Silicon; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2005. Proceedings. 55th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-8907-7
  • Type

    conf

  • DOI
    10.1109/ECTC.2005.1441419
  • Filename
    1441419
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3348744