Drop Impact: Fundamentals and Impact Characterisation of Solder Joints

Author

Wong, E.H. ; Rajoo, R. ; Mai, Y.-W. ; Seah, S.K.W. ; Tsai, K.T. ; Yap, L.M.

fYear

0

fDate

0-0 0

Firstpage

1202

Lastpage

1209

Abstract

This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact assembly, dynamics of PCB, as well as interconnection stress. This is followed by a comprehensive study of the fracture characteristics of solder interconnections under high-speed impact using a newly developed Micro Impactor which provides both the fracture strength as well as fracture energy of impact. The test matrix consists of 5 solder alloys, 4 pad finishing, 3 thermal histories, and 2 solder mask designs forming a total of 120 combinations. The test has highlighted weakness in NSMD design and caution on SnAgCu solder when used in drop impact application

Keywords

assembling; copper alloys; fracture toughness; impact strength; impact testing; silver alloys; solders; tin alloys; NSMD design; PCB dynamics; SnAgCu; board level drop impact; drop impact assembly; fracture characteristics; fracture energy; fracture strength; interconnection stress; microimpactor; pad finishing; solder alloys; solder interconnections; solder joints; solder mask designs; test matrix; thermal histories; Assembly; Electric shock; Finishing; History; Numerical simulation; Soldering; Temperature; Testing; Thermal stresses; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2005. Proceedings. 55th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

0-7803-8907-7

Type

conf

DOI

10.1109/ECTC.2005.1441423

Filename

1441423