Recent Advances in Ceramic Composite Substrate Materials for High-Density and High Reliability Packaging Applications
Author :
Kumbhat, Nitesh ; Raj, P. Markondeya ; Pucha, Raghuram V. ; Atmur, Steve ; Doraiswamy, Ravi ; Sundaram, Venky ; Bhattacharya, Swapan ; Sitaraman, Suresh K. ; Tummala, Rao R.