DocumentCode :
3349267
Title :
Recent Advances in Ceramic Composite Substrate Materials for High-Density and High Reliability Packaging Applications
Author :
Kumbhat, Nitesh ; Raj, P. Markondeya ; Pucha, Raghuram V. ; Atmur, Steve ; Doraiswamy, Ravi ; Sundaram, Venky ; Bhattacharya, Swapan ; Sitaraman, Suresh K. ; Tummala, Rao R.
fYear :
2005
fDate :
May 31 2005-June 3 2005
Firstpage :
1364
Lastpage :
1372
Keywords :
Ceramics; Composite materials; Dielectric substrates; Electronic packaging thermal management; Materials reliability; Organic materials; Residual stresses; Testing; Thermal stresses; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2005. Proceedings. 55th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-8907-7
Type :
conf
DOI :
10.1109/ECTC.2005.1441447
Filename :
1441447
Link To Document :
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