Title :
A dry migration? Copper dendrite growth in adhesive tape during burn-in
Author :
Tan, S.H. ; Ong, S.H.
Author_Institution :
Failure Analysis Lab., Nat. Semicond. Manuf. Ltd., Singapore
Abstract :
Copper migration which exhibits dendrite short-circuits in conductor-insulator-conductor structures may result in failure and reliability problems in microcircuits. Earlier works (Harsanyi, 1995; Adema et al., 1990 and 1993; Rudra and Jennings, 1994; Nieman, 1994; Harsanyi, 1999) have shown this mechanism in moist conditions. This is known as wet migration. In this investigation, we have observed copper dendrite growth during burn-in stress in adhesive tape which was used for leadframes to maintain the coplanarity and stability of individual lead pins during semiconductor manufacturing. A special parallel lapping technique revealed the dendrite growth under the tape. It is believed that chemical interaction has taken place, especially due to polyamic acid, which apparently reacts with copper. Further evaluations with higher temperature and voltage simulation confirm this mechanism
Keywords :
MIM structures; adhesives; circuit simulation; circuit stability; copper; dendrites; electromigration; failure analysis; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; moisture; Cu; IC failure; IC reliability; adhesive tape; burn-in; burn-in stress; chemical interaction; conductor-insulator-conductor structures; copper dendrite growth; copper migration; dendrite growth; dendrite short-circuits; dry migration; lead pin coplanarity; lead pin stability; leadframes; microcircuits; moist conditions; parallel lapping technique; polyamic acid; semiconductor manufacturing; simulation; wet migration; Chemicals; Copper; Lapping; Lead compounds; Pins; Semiconductor device manufacture; Stability; Stress; Temperature; Voltage;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2001. IPFA 2001. Proceedings of the 2001 8th International Symposium on the
Print_ISBN :
0-7803-6675-1
DOI :
10.1109/IPFA.2001.941481
