Title :
Bulk phase explosion and surface boiling during short pulse laser ablation of semiconductors
Author :
Sokolowski-Tinten, K. ; Bialkomiski, J. ; Boing, M. ; Cavalleri, A. ; von der Linde, D.
Author_Institution :
Inst. fur Laser- und Plasmaphys., Essen Univ., Germany
Abstract :
Summary form only given. Femtosecond laser ablation of semiconductors has been studied in our group with a number of techniques, including time resolved microscopy and time-of-flight mass spectroscopy. The physical pathway which results in the removal of material can be summarised as follows. The laser pulse excites a very dense electron-hole plasma in the semiconductor, leading to nonthermal melting on a sub-picosecond timescale. The liquid is left in a state of high temperature (T>3000 K/sup 2/) and high pressure. The pressure drives expansion of the material into vacuum and homogeneous nucleation of the gas phase (phase explosion) takes place within a few tens of picoseconds. The material decomposes into a non-homogeneous mixture of liquid and gas, eventually transforming into a gas upon further dilution.
Keywords :
boiling; explosions; high-speed optical techniques; laser ablation; melting; nucleation; semiconductor plasma; semiconductors; surface phase transformations; time of flight mass spectra; bulk phase explosion; dense electron-hole plasma; femtosecond laser ablation; gas; gas phase; homogeneous nucleation; laser pulse; liquid; nonhomogeneous mixture; nonthermal melting; phase explosion; physical pathway; pressure; semiconductors; short pulse laser ablation; sub-picosecond timescale; surface boiling; time resolved microscopy; time-of-flight mass spectroscopy; Explosions; Laser ablation; Laser theory; Microscopy; Optical materials; Optical pulses; Plasma temperature; Semiconductor lasers; Semiconductor materials; Surface emitting lasers;
Conference_Titel :
Quantum Electronics and Laser Science Conference, 1999. QELS '99. Technical Digest. Summaries of Papers Presented at the
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
1-55752-576-X
DOI :
10.1109/QELS.1999.807592