• DocumentCode
    3351849
  • Title

    3D Simulation of transient current and charge collection induced by heavy ion in SOI transistors

  • Author

    Zhang, Xiaochen ; Yue, Suge ; Wang, Liang

  • Author_Institution
    Designing Dept., Beijing Microelectron. Inst. Technol., Beijing, China
  • fYear
    2010
  • fDate
    12-15 Oct. 2010
  • Firstpage
    93
  • Lastpage
    96
  • Abstract
    The 3D simulation result shows how the heavy ion strike location, the structure (with or without body contact) of the device, and the energy of strike ion affect the parasitic bipolar gain. Short distance between strike location and body contact reduces the charge collection by drain more obviously than that in the case of longer distance. The highlight of the paper lies in the discovery and analysis of charge collection amplification absence in the device with body contact. Although no bipolar amplification is observed macroscopically, there is still parasitic bipolar element turned on for a short time. The short duration of the electron injection from source and the electron collection of the source reduce the charge collection of drain.
  • Keywords
    amplification; bipolar transistors; charge injection; semiconductor device models; silicon-on-insulator; 3D simulation; SOI transistor; Si; bipolar amplification; body contact; charge collection amplification; electron injection; heavy ion; parasitic bipolar element; parasitic bipolar gain; strike location; transient current; Charge carrier processes; Integrated circuit modeling; Logic gates; Single event upset; Transient analysis; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    978-1-4244-8896-4
  • Type

    conf

  • DOI
    10.1109/NMDC.2010.5652561
  • Filename
    5652561