• DocumentCode
    3351855
  • Title

    Fast error-correcting circuits for fault-tolerant memory

  • Author

    Ou, Elaine ; Yang, Woodward

  • Author_Institution
    VLSI Group, Harvard Univ., Cambridge, MA, USA
  • fYear
    2004
  • fDate
    9-10 Aug. 2004
  • Firstpage
    8
  • Lastpage
    12
  • Abstract
    This work explores the design and analysis of an error-correcting circuit as applied to high density and low latency memories, especially NOR Flash and DRAM. In very high density semiconductor memory products, exhaustive testing and repair procedures are essential to insure the proper operation of every memory location under worst possible conditions and can account for a significant portion of the total production cost. The implementation of error-correcting circuits in conjunction with other currently-used methods for designing more fault-tolerant high density memory could allow for more simplified testing procedures after memory fabrication and significantly reduce the overall cost. Also, error-correcting circuits could increase the reliability of the memory and extend its lifetime. This paper illustrates one possible implementation of error-correcting circuits, in the form of a Hamming decoder. Clocking was accomplished with asynchronous pulse generators to ensure fast cycle times and minimal decoding delay. These circuits were designed to show that error correction can be achieved with minimal additional circuitry, system complexity, power consumption and latency.
  • Keywords
    circuit reliability; error correction codes; memory architecture; production; random-access storage; DRAM; Hamming decoder; NOR Flash; asynchronous pulse generators; clocking; cycle times; decoding delay; error correction; exhaustive testing; fast error-correcting circuits; fault-tolerant memory; high density memories; high density semiconductor memory; low latency memories; memory fabrication; memory location; minimal additional circuitry; power consumption; production cost; repair procedures; system complexity; testing procedures; worst possible conditions; Circuit testing; Costs; Decoding; Delay; Error analysis; Fault tolerance; Production; Random access memory; Semiconductor device testing; Semiconductor memory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Technology, Design and Testing, 2004. Records of the 2004 International Workshop on
  • ISSN
    1087-4852
  • Print_ISBN
    0-7695-2193-2
  • Type

    conf

  • DOI
    10.1109/MTDT.2004.1327977
  • Filename
    1327977