DocumentCode :
3352818
Title :
A unique approach to yield enhancement/defect characterization using electrical comb monitors
Author :
Morrison, William R. ; Campbell, John P. ; Shaw, Judy B.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
fYear :
1995
fDate :
17-19 Sep 1995
Firstpage :
161
Lastpage :
164
Abstract :
Comb/serpent defect monitors are typically used to characterize and understand process yields on production by mimicking actual production flow. In contrast, a unique application of comb/serpent defect monitors is discussed. By processing the monitors in a non-standard process flow compared to production wafers, sources of defects can be definitively isolated and then eliminated. Comb/serpent defect monitors are an important supplement to any yield improvement plan because: (1) They definitely pinpoint the source process which is affecting yield. (2) They determine the kill ratio of each defect type. As design rules shrink and semiconductor devices add multiple layers of metal the detectability of killing defects using inline inspections diminishes, thus does the need increase for type of defect partitioning described herein. Advantages and disadvantages as well as specific examples of the benefits of comb/serpent monitors in a 0.6 μm CMOS process manufacturing environment are discussed. Also discussed is the use of this non-standard process flow material to monitor key yield impact in an integrated process instead of using a PWP monitor
Keywords :
CMOS integrated circuits; inspection; integrated circuit yield; monitoring; 0.6 micron; CMOS process; defect partitioning; electrical comb monitors; inspection; kill ratios; nonstandard process flow; semiconductor manufacturing; serpent monitors; short flow wafers; yield enhancement; CMOS process; Etching; Flow production systems; Inspection; Instruments; Manufacturing processes; Metallization; Semiconductor devices; Semiconductor materials; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 1995., IEEE/UCS/SEMI International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2928-7
Type :
conf
DOI :
10.1109/ISSM.1995.524381
Filename :
524381
Link To Document :
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