Title :
On the study of MOSFET micro-sensors for electronic packaging
Author :
Yang, M.I. ; Chao, Y.C. ; Tseng, K.F. ; Chung, H. ; Tang, C.P. ; Lwo, B.J.
Author_Institution :
Chung-Cheng Inst. of Technol., Nat. Defense Univ., Taoyuan
Abstract :
The purpose of this paper is to study the MOSFET stress sensor behaviors and to develop the related measurement methodology. With the newly developed technology, the piezoresistance coefficients of the MOSFET were extracted, and the strain and temperature effect induced MOSFET characteristics were obtained. The results of this study can be used to adjust the chip structure in a packaging so that the optimal packaging technology and material can be chosen, and accuracies of the numerical analysis can be verified through experimental data with the new technology studied in this paper.
Keywords :
MOSFET; microsensors; numerical analysis; piezoresistance; semiconductor device packaging; strain measurement; temperature measurement; MOSFET; chip structure; electronic packaging; microsensor; numerical analysis; optimal packaging technology; piezoresistance coefficient; strain effect; stress sensor; temperature effect; Capacitive sensors; Data mining; Electronics packaging; MOSFET circuits; Numerical analysis; Piezoresistance; Semiconductor device measurement; Sensor phenomena and characterization; Stress measurement; Temperature sensors;
Conference_Titel :
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location :
Daejeon
Print_ISBN :
978-1-4244-1909-8
Electronic_ISBN :
978-1-4244-1910-4
DOI :
10.1109/EMAP.2007.4510281
