DocumentCode
3353476
Title
Formation of Sn-multiwalled carbon nanotube composite layer for the application of thermal interface materials
Author
Lee, Jung-Sub ; Vaidyanathan, Sivakumar ; Jeon, Duk Young
Author_Institution
Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon
fYear
2007
fDate
19-22 Nov. 2007
Firstpage
1
Lastpage
6
Abstract
Fabrication of Sn-MWCNT composite layer through reflow of Sn-decorated MWCNT powder was conducted in this study. Commercially available MWCNTs were oxidized by using K2Cr2O7 / H2SO4 solution for the surface modification. The oxidized MWCNTs were dispersed in SnCL / HCl solution and subsequently a reducing agent NaBH4 was introduced to form crystalline Sn. During the Sn reduction process, 1,10-phenanthroline capping agent was introduced to control the particle shape and size. It was found that SnO2 nanoparticles on the surface of MWCNTs and crystalline Sn particles were obtained simultaneously through the chemical reduction reaction. When 1,10-phenanthroline was used, Sn particles had spherical shape and uniform size compared to the one without 1,10-phenanthroline. Afterwards, the Sn-MWCNT powders were mixed with a flux to form a paste for a wetting test on a Cu substrate. After a reflow step of the paste, Sn-MWCNT composite layer could be formed showing no separation between MWCNTs and Sn by bonding of molten Sn to SnO2 nanoparticles on the surface of MWCNTs.
Keywords
bonding processes; carbon nanotubes; copper; interface phenomena; nanoparticles; thermal management (packaging); tin; wetting; 1,10-phenanthroline capping agent; Cu; K2Cr2O7-H2SO4; MWCNT powder; MWCNT surface modification; NaBH4; Sn-C; SnCl2-HCl; SnO2; chemical reduction reaction; copper substrates; multiwalled carbon nanotube composite layer fabrication; nanoparticles; particle shape control; phenanthroline; thermal management; tin reduction process; wetting test; Carbon nanotubes; Composite materials; Conducting materials; Crystallization; Fabrication; Nanoparticles; Organic materials; Powders; Shape control; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location
Daejeon
Print_ISBN
978-1-4244-1909-8
Electronic_ISBN
978-1-4244-1910-4
Type
conf
DOI
10.1109/EMAP.2007.4510301
Filename
4510301
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