DocumentCode :
3354650
Title :
A Dynamic Model and Analysis of a Single Biological Cell
Author :
Molavi, Marjan ; Stiharu, Ion
Author_Institution :
Dept. of Mech. & Ind. Eng., Concordia Univ., Montreal, Que.
Volume :
4
fYear :
2006
fDate :
9-13 July 2006
Firstpage :
3328
Lastpage :
3331
Abstract :
The relationship between composition and structure of primary cell walls, and cell mechanical properties is not fully understood because intrinsic properties of walls such as Young´s modulus cannot be readily obtained. The aim of this work is to show that Young´s modulus of walls of single yeast cell can be determined by dynamic modeling and analyzing the cell by finite element methods. In this investigation a spherical membrane was defined to benchmark an idealized shape model for yeast cell. Based on the open literature a resonant frequency in the range of 0.8 to 1.6 kHz was assumed for this benchmark cell. Mechanical properties of the cell have been investigated by substituting different modulus of elasticity, radius, density and thickness to fine-tune the results within the range of assumed periodic motions. The effect of different parameters such as, radius, density, thickness and modulus of elasticity on frequency was further investigated through dynamic performance analysis using FEA, in this case ANSYS. The results show that the experimental and the FEM approach agree with each other in some parameters within a reasonable band
Keywords :
Young´s modulus; biomembranes; cellular biophysics; density; elasticity; finite element analysis; 0.8 to 1.6 kHz; ANSYS; Young´s modulus; cell mechanical properties; dynamic performance analysis; finite element methods; intrinsic properties; mechanical properties; primary cell walls; resonant frequency; single biological cell; spherical membrane; Biological cells; Biological system modeling; Biomembranes; Elasticity; Finite element methods; Fungi; Mechanical factors; Performance analysis; Resonant frequency; Shape;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics, 2006 IEEE International Symposium on
Conference_Location :
Montreal, Que.
Print_ISBN :
1-4244-0496-7
Electronic_ISBN :
1-4244-0497-5
Type :
conf
DOI :
10.1109/ISIE.2006.295999
Filename :
4078927
Link To Document :
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