DocumentCode
3356791
Title
Effects of 3D shapes in PWB design
Author
Peltola, Tero ; Mansikkamäki, Pauliina ; Ristolainen, Eero O.
Author_Institution
Asperation Oy, Tampere, Finland
fYear
2005
fDate
31 May-3 June 2005
Firstpage
1870
Abstract
Nowadays the outlook of any device can be a more important issue than the technical features inside it. Inevitably all these new and interesting features must be covered with a successfully designed package. Traditional rigid printed wiring board (PWB) can be a restriction for the designer, and, therefore, in some futuristic and novel designs, it is not used any more. A formable 3D multilayer PWB can be an answer for a faddish package without a traditional PWB. Formability brings 3D shapes into the PWB that will introduce new challenges to overcome. This paper discusses the role of 3D shapes in PWB design, and presents one solution to overcome these challenges. By designing a unique support structure for each 3D shape the inconvenient distortions can be controlled. Support structures enable the designers to use formable multilayer structures effectively, and the design freedom is one step closer.
Keywords
printed circuits; 3D shapes; PWB design; multilayer structures; printed wiring board; Consumer behavior; Databases; Dielectric materials; Electronics packaging; Mass production; Nonhomogeneous media; Shape control; Technological innovation; Usability; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2005. Proceedings. 55th
ISSN
0569-5503
Print_ISBN
0-7803-8907-7
Type
conf
DOI
10.1109/ECTC.2005.1442052
Filename
1442052
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