DocumentCode
3358882
Title
The ESR characters of unintentionally doped 4H-SiC with Si ion implanted
Author
Ping Cheng ; Ming Wang ; Lizhi Wang ; YuMing Zhang ; Hui Guo
Author_Institution
Inf. Eng. Coll., Ningbo Dahongying Univ., Ningbo, China
Volume
3
fYear
2011
fDate
12-14 Aug. 2011
Firstpage
1340
Lastpage
1342
Abstract
The intrinsic defects in epitaxial semi-insulating 4H-SiC that are implanted by Si ion, annealing after implanted respectively are studied by electron spin resonance (ESR). The results show that the intrinsic defects in Si ion implanted and annealing are the same as that as-grown 4H-SiC consist of carbon vacancy (Vc) and complex-compounds-related Vc, which is to say Si ion implanted and annealing treatment have a few effects on the intrinsic defects in unintentionally doped 4H-SiC prepared by low pressure chemical vapor deposition. The ESR spectrum are the same as that as-grown samples with Xe light, which are illumination time changes the relative density of intrinsic defects in 4H-SiC; the relative density of intrinsic defects reaches a maximum when the illumination time is 2.5 min, and the ratio of Vc to complex compounds is minimized simultaneously. It can be deduced that some Vsi may be transformed to the complex-compounds-related Vc because of the illumination.
Keywords
annealing; density; ion implantation; paramagnetic resonance; semiconductor doping; semiconductor epitaxial layers; silicon; silicon compounds; vacancies (crystal); wide band gap semiconductors; ESR character; ESR spectrum; SiC:Si; annealing treatment; complex-compound-related carbon vacancy; electron spin resonance character; epitaxial semiinsulator; intrinsic defect; low pressure chemical vapor deposition; relative density; time 2.5 min; Annealing; Epitaxial growth; Lighting; Silicon; Silicon carbide; Substrates; Xenon; electron spin resonance; intrinsic defects; low pressure chemical vapor deposition; semi-insulating 4H-SiC;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
Conference_Location
Harbin, Heilongjiang, China
Print_ISBN
978-1-61284-087-1
Type
conf
DOI
10.1109/EMEIT.2011.6023341
Filename
6023341
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