• DocumentCode
    3359623
  • Title

    A high-speed, low-power 3D-SRAM architecture

  • Author

    Nho, H. Henry ; Horowitz, Mark ; Wong, S. Simon

  • Author_Institution
    Stanford Univ., Stanford, CA
  • fYear
    2008
  • fDate
    21-24 Sept. 2008
  • Firstpage
    201
  • Lastpage
    204
  • Abstract
    This paper presents a novel 3D-SRAM architecture that can be used to extend the scaling of SRAM. This architecture significantly reduces the bit-line capacitance, achieves 3.4 times reduction in active power consumption and 1.8 times reduction in access time. In this architecture, local bit-lines are vertical and connect through select transistors to the global bit-lines routed on the bottom level. A proof-of-concept 32Kb sub-array emulating the critical path of the 3D-SRAM has demonstrated about 5 times improvement in power-delay over conventional 2D-SRAM.
  • Keywords
    SRAM chips; capacitance; low-power electronics; transistor circuits; 3D-SRAM architecture; bit-line capacitance; transistors; Decoding; Degradation; Delay; Energy consumption; Integrated circuit technology; Parasitic capacitance; Power dissipation; Random access memory; Silicon; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2018-6
  • Electronic_ISBN
    978-1-4244-2019-3
  • Type

    conf

  • DOI
    10.1109/CICC.2008.4672058
  • Filename
    4672058