DocumentCode :
3360513
Title :
Microelectronics for the real world: “Moore” versus “More than Moore”
Author :
Kent, John P. ; Prasad, Jagdish
Author_Institution :
ON Semicond., Pocatello, ID
fYear :
2008
fDate :
21-24 Sept. 2008
Firstpage :
395
Lastpage :
402
Abstract :
Memories and microprocessors improvements rely on the continued scaling in silicon based CMOS technologies known as ldquoMoorepsilasrdquo law. However, new classes of products are emerging that provide additional value based on functional innovation and diversification instead of scaling. This functional diversification is being called ldquoMore-than-Moorerdquo. Product innovation in ldquoMore-than-Moorerdquo technologies is differentiated by circuit design, architecture, embedded software and unique process technology. These innovations enable the use of older, proven technologies in highly reliable products. This approach allows for non-digital functions such as RF, power control, passive components, sensors and actuators to migrate from the system board level into a package level (SiP) or chip level (SoC) implementation. The objective of ldquoMore-than-Moorerdquo is to incorporate digital and non-digital functionality into compact systems. ldquoMore-than-Moorerdquo technologies are application specific and focus on the interface between the ldquoAnalogrdquo and the digital world. In this paper we will discuss the applications of ldquoMore-than-Moorerdquo concept and its utility in real life.
Keywords :
CMOS integrated circuits; microprocessor chips; CMOS technologies; More-than-Moore; chip level; embedded software; functional diversification; microelectronics; product innovation; system board level; CMOS technology; Circuit synthesis; Computer architecture; Embedded software; Microelectronics; Microprocessors; Power system reliability; Radio frequency; Silicon; Technological innovation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 2008. CICC 2008. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2018-6
Electronic_ISBN :
978-1-4244-2019-3
Type :
conf
DOI :
10.1109/CICC.2008.4672103
Filename :
4672103
Link To Document :
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