Lead Free Through Hole Technology (THT) and Contact Repeatability in In-Circuit Test

Author

Reinosa, Rosa D.

Author_Institution

Hewlett-Packard Co., Palo Alto, CA

fYear

2006

fDate

Oct. 2006

Firstpage

1

Lastpage

10

Abstract

The European Union Restriction of Hazardous Substances (RoHS) Directive banned the use of lead in electronic equipment on July 1st 2006. Contact repeatability performance is an important driver in the selection of lead free materials, as well as, the effects that manufacturing processes (through hole reflow (THR), wave, selective wave) have on testability of PCAs (printed circuit assemblies). In-circuit test probe contact repeatability performance is presented for various lead free material combinations (paste, fluxes, surface finishes) and their impact on test targets that have been exposed to through hole reflow, wave and selective wave manufacturing processes

Keywords

RoHS compliance; assembling; printed circuit manufacture; printed circuit testing; reflow soldering; European Union Restriction of Hazardous Substances; RoHS Directive; contact repeatability; electronic equipment; fluxes; in-circuit test probe; lead free materials; lead free through hole technology; manufacturing processes; paste; printed circuit assemblies; surface finishes; Assembly; Circuit testing; Driver circuits; Electronic equipment; Environmentally friendly manufacturing techniques; Manufacturing processes; Materials testing; Principal component analysis; Printed circuits; Probes;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 2006. ITC '06. IEEE International

Conference_Location

Santa Clara, CA

ISSN

1089-3539

Print_ISBN

1-4244-0292-1

Electronic_ISBN

1089-3539

Type

conf

DOI

10.1109/TEST.2006.297709

Filename

4079387