DocumentCode :
3362870
Title :
Off-diagonal thermoelectric effect in tilted layered materials
Author :
Takahashi, Kouhei ; Kanno, Tsutomu ; Sakai, Akihiro ; Omote, A. ; Adachi, Hideaki ; Yamada, Yuka
Author_Institution :
Adv. Technol. Res. Labs., Panasonic Corp., Kyoto, Japan
fYear :
2011
fDate :
18-21 Oct. 2011
Firstpage :
56
Lastpage :
60
Abstract :
Off-diagonal thermoelectric effect is an unconventional thermoelectric phenomenon which emerges in layered materials with tilted alignment. Here, we report development of unique functionalities using the off-diagonal thermoelectric effect in two different material systems; (i) tilted-oriented thin films of layered cobaltite CaxCoO2, and (ii) artificial tilted multilayer of Bi/Cu and Bi0.5Sb1.5Te3/Ni. CaxCoO2 thin films enabled generation of an extremely large film in-plane voltage of 1 V by introducing a unit temperature difference in the film out-of-plane. On the other hand, Bi/Cu multilayer showed enhanced power factor of 50.1 μW/cmK2, which was ~1.5 times larger than that of the constituent Bi alone. We also realized high electrical power generation of 1.3 W in the Bi0.5Sb1.5Te3/Ni multilayer fabricated in a tubular structure. These features provide potential applications to sensitive optical/thermal sensors and high-power thermoelectric generators.
Keywords :
antimony alloys; bismuth; bismuth alloys; calcium compounds; copper; materials preparation; multilayers; nickel; optical sensors; tellurium alloys; thermoelectricity; thin films; Bi-Cu; Bi0.5Sb1.5Te3-Ni; CaxCoO2; artificial tilted multilayer; film out-of-plane; high electrical power generation; high-power thermoelectric generator; layered cobaltite; off-diagonal thermoelectric effect; optical sensor; power 1.3 W; thermal sensor; tilted layered material; tilted-oriented thin film; tubular structure; voltage 1 V; Biomedical optical imaging; Bismuth; Films; Heating; Optical design; Optical sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanotechnology Materials and Devices Conference (NMDC), 2011 IEEE
Conference_Location :
Jeju
Print_ISBN :
978-1-4577-2139-7
Type :
conf
DOI :
10.1109/NMDC.2011.6155312
Filename :
6155312
Link To Document :
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