DocumentCode
3363007
Title
R1 — A reliability comparison study between 14 lead free alloys
Author
Wohlrabe, Heinz ; Reichelt, Gundolf
Author_Institution
Centre of Microtechnical Manuf., Dresden Univ. of Technol., Dresden, Germany
fYear
2013
fDate
11-13 Dec. 2013
Firstpage
292
Lastpage
297
Abstract
The reliability of solder joints is one important part of the quality of SMT-Boards. The paper presents a reliability study named R1. The base of the study is a reliability experiment with 14 different solder alloys (13 lead free solders and a Sn63 alloy as a reference), six different surfaces, six different SMD-chips combined with three different pad layouts. A high cycle reliability test was used. The times of failures were evaluated with the Weibull analysis followed by an analysis of variance.
Keywords
Weibull distribution; reliability; solders; statistical analysis; surface mount technology; tin alloys; R1 reliability comparison study; SMD-chips; SMT-boards; Sn; Weibull analysis; analysis of variance; high cycle reliability test; lead free alloys; pad layouts; solder joint reliability; time of failures; Environmentally friendly manufacturing techniques; Layout; Metals; Reliability; Shape; Soldering; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
Conference_Location
Singapore
Print_ISBN
978-1-4799-2832-3
Type
conf
DOI
10.1109/EPTC.2013.6745730
Filename
6745730
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