• DocumentCode
    3363267
  • Title

    Thermal performance of a double-action pulsed jet CPU cooler

  • Author

    Chandratilleke, Tilak T. ; Rakshit, Dibakar

  • Author_Institution
    Dept. of Mech. Eng., Curtin Univ., Perth, WA, Australia
  • fYear
    2013
  • fDate
    11-13 Dec. 2013
  • Firstpage
    353
  • Lastpage
    357
  • Abstract
    More efficient and compact thermal management techniques are critical for the development of Central Processing Units (CPU) embedded in complex and powerful modern computer systems. Introducing a technological alternative to conventional fan-cooled systems, this paper presents an experimental investigation of a double-action CPU cooler based on the pulsed (or synthetic) jet principle. The study develops a prototype of this new CPU cooler and tests it for a range of operating conditions to ascertain its cooling capabilities. The performance of this device is compared with a conventional fan CPU heat sink design for evaluating the relative thermal advantages of the new configuration. It is observed that the pulsed-jet CPU cooler achieves about 1.5 times more heat removal rate than a comparable fan CPU cooler. Whilst thermal optimisation is feasible, it is recognised that this pulsed jet arrangement has unique surface cooling ability without additional fluid circuits, making it particularly desirable for high-capacity electronic cooling applications.
  • Keywords
    cooling; heat sinks; microprocessor chips; thermal management (packaging); CPU heat sink; central processing units; double-action CPU cooler; double-action pulsed jet cooler; fan-cooled systems; modern computer systems; pulsed jet arrangement; surface cooling ability; thermal management techniques; thermal optimisation; thermal performance; Central Processing Unit; Cooling; Fluids; Heat transfer; Resistance heating; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4799-2832-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2013.6745741
  • Filename
    6745741