DocumentCode
3364159
Title
An investigation of power delay trade-offs for dual Vt CMOS circuits
Author
Wang, Qi ; Vrudhula, Sarma B K
Author_Institution
Cadence Design Syst. Inc., Santa Clara, CA, USA
fYear
1999
fDate
1999
Firstpage
556
Lastpage
562
Abstract
The availability of the dual Vt CMOS process provides a practical way to achieve high performance and low leakage power dissipation for current deep submicron technology. Early work on leakage power optimization of digital circuits utilizing dual Vt devices show some promising results (Kao et al., 1997). However, due to the lack of real dual Vt process models and parameters, these works are based on simple power and delay analysis of dual Vt devices. For example, the impact of dual Vt on the short circuit power dissipation is ignored in all these works. We provide extensive HSPICE simulation results on CMOS gates and circuits from a commercial dual Vt CMOS process. The experimental results show that optimization of dual Vt circuits involves complex trade-offs between leakage power, short circuit power and performance. For example, it is observed that using lower Vt devices does not always result in a faster circuit. One of the main contributions of this paper is that it reveals some new challenges and opportunities offered by the dual Vt technology to both circuit designers and CAD software developers for circuit optimization
Keywords
CMOS logic circuits; SPICE; circuit optimisation; digital simulation; logic CAD; logic gates; CAD; CMOS gates; HSPICE simulation; circuit optimization; deep submicron technology; delay analysis; digital circuits; dual Vt CMOS circuits; experimental results; low leakage power dissipation; power delay trade-offs; Availability; CMOS process; CMOS technology; Circuit optimization; Circuit simulation; Delay; Design automation; Digital circuits; Power dissipation; Software design;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design, 1999. (ICCD '99) International Conference on
Conference_Location
Austin, TX
ISSN
1063-6404
Print_ISBN
0-7695-0406-X
Type
conf
DOI
10.1109/ICCD.1999.808595
Filename
808595
Link To Document