• DocumentCode
    3364175
  • Title

    Charge density formulation for plasmons in the retarded regime

  • Author

    Smaili, Sami ; Massoud, Yehia

  • Author_Institution
    Electr. & Comput. Eng. Dept., Univ. of Alabama at Birmingham, Birmingham, AL, USA
  • fYear
    2011
  • fDate
    18-21 Oct. 2011
  • Firstpage
    357
  • Lastpage
    361
  • Abstract
    In this paper we derive the retarded dispersion relation for plasmons at the interface between a semi-infinite metal and a semi-infinite dielectric starting from the charge density and the current density. We use the retarded electric and magnetic potentials to arrive at the surface plasmon dispersion relation. Additionally, we derive the electric and magnetic fields using the potentials and show that the derived field components obey the same relations with respect to each other as the plasmon fields. The approach we present in this paper is helpful for deriving transmission line models for plasmonic interconnect structures, which are proposed as replacements for the traditional copper interconnects in future VLSI systems. This in turn is important to study the properties of such structures as interconnects.
  • Keywords
    charge density waves; copper; current density; dielectric function; dispersion relations; electric fields; magnetic fields; permittivity; plasmonics; surface plasmons; Cu; VLSI system; charge density formulation; copper interconnects; current density; dielectric constant; dielectric function; electric fields; magnetic fields; plasmonic interconnect structure; semiinfinite dielectric; semiinfinite metal; surface plasmon dispersion relation; transmission line models; CMOS integrated circuits; Computational modeling; Delay; Integrated circuit modeling; Magnetic separation; Optical filters; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology Materials and Devices Conference (NMDC), 2011 IEEE
  • Conference_Location
    Jeju
  • Print_ISBN
    978-1-4577-2139-7
  • Type

    conf

  • DOI
    10.1109/NMDC.2011.6155376
  • Filename
    6155376