• DocumentCode
    336495
  • Title

    An exact analytical time-domain model of distributed RC interconnects for high speed nonlinear circuit applications

  • Author

    Lu, Ninglong ; Hajj, Ibrahim N.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • fYear
    1999
  • fDate
    4-6 Mar 1999
  • Firstpage
    68
  • Lastpage
    71
  • Abstract
    Accurate simulation of interconnect effects is an increasingly critical step in high speed deep submicron design. With ever increasing frequency of digital/analog signals, the traditional lumped RC elements may not be accurate enough in modeling RC interconnects in VLSI applications due to the distributed nature of realistic interconnects. In this paper a novel analytic time-domain model for distributed RC interconnects is developed for application in nonlinear circuit simulators. The exact analytical solution is derived under the assumption of piecewise-linear signal waveforms at the two ports of the line. We have incorporated this model into a general purpose circuit simulator using the SWEC technique
  • Keywords
    RC circuits; VLSI; circuit simulation; distributed parameter networks; high-speed integrated circuits; integrated circuit modelling; nonlinear network analysis; piecewise linear techniques; time-domain analysis; RC interconnect modelling; SWEC technique; VLSI applications; analytical time-domain model; distributed RC interconnects; high speed circuit applications; high speed deep submicron design; interconnect effects simulation; nonlinear circuit applications; nonlinear circuit simulators; piecewise-linear signal waveforms; Analytical models; Circuit simulation; Distributed parameter circuits; Equations; Integrated circuit interconnections; Nonlinear circuits; Signal analysis; Time domain analysis; Transmission lines; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI, 1999. Proceedings. Ninth Great Lakes Symposium on
  • Conference_Location
    Ypsilanti, MI
  • ISSN
    1066-1395
  • Print_ISBN
    0-7695-0104-4
  • Type

    conf

  • DOI
    10.1109/GLSV.1999.757379
  • Filename
    757379