The use of ozonated water as resist strip and post ash clean in a production fab

Author

Vroom, R. ; De Gendt, S.

Author_Institution

Philips Semicond. BV, Nijmegen, Netherlands

fYear

1999

fDate

1999

Firstpage

165

Lastpage

168

Abstract

In this paper, a study of resist strip in three different aqueous ozonated chemistry processes is reported. This new environmental friendly process is considered mainly as an alternative for sulfuric based processes. It has potential to reduce the cost of ownership (CoO) and environmental impact of the current resist strip processes. Implementation of any of these new processes can be done on existing equipment in the production area without major modifications

Keywords

environmental factors; integrated circuit manufacture; ozone; photoresists; surface cleaning; water; O₃-H₂O; aqueous ozonated chemistry processes; cost of ownership; defect density; deionized water; environmental friendly process; environmental impact; metal contamination; oxide quality; oxide thickness; ozonated water; particle performance; post ash clean; process time; production fab; resist strip; yield; Ash; Cleaning; Costs; Plasma chemistry; Plasma materials processing; Plasma temperature; Production; Resists; Scanning probe microscopy; Strips;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on

Conference_Location

Santa Clara, CA

ISSN

1523-553X

Print_ISBN

0-7803-5403-6

Type

conf

DOI

10.1109/ISSM.1999.808763

Filename

808763