• DocumentCode
    3367386
  • Title

    Defect isolation and characterization in contact array/chain structures by using voltage contrast effect

  • Author

    Sakai, Tctsuya ; Oda, Noriaki ; Yokoyama, Takashi ; Kikuchi, Hiroaki ; Kitajima, H.

  • Author_Institution
    ULSI Device Dev. Lab., NEC Corp., Kanagawa, Japan
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    195
  • Lastpage
    198
  • Abstract
    Voltage contrast effect measurement, a conventional technique for isolating open contacts, was applied to high-resistance contact isolation. The detectable lower limit was clarified experimentally and theoretically. The passive voltage contrast effect is a transitional phenomenon, so the analysis conditions must be optimized for the device properties and primary beam irradiation. The detectable lower resistance limit was 1E9 Ω at most. The biased voltage contrast effect is steady state, so it could be used to isolate failed via modules whose resistance was 1E4-1E5 Ω, even when the current of the primary beam was small
  • Keywords
    CMOS integrated circuits; contact resistance; failure analysis; fault location; focused ion beam technology; integrated circuit interconnections; integrated circuit metallisation; integrated circuit testing; transmission electron microscopy; voltage measurement; 1E4 to 1E5 ohm; 1E9 ohm; CMOS process; FIB systems; TEM; biased voltage contrast effect; contact array/chain structures; defect isolation; detectable lower limit; detectable lower resistance limit; failed via modules; high-resistance contact isolation; high-resistance via; parasitic capacitance; passive voltage contrast effect; primary beam irradiation; secondary electron mode images; voltage contrast effect; Aluminum; Capacitance; Contact resistance; Detectors; Electric potential; Electric resistance; Electrons; Failure analysis; Voltage; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-5403-6
  • Type

    conf

  • DOI
    10.1109/ISSM.1999.808770
  • Filename
    808770