DocumentCode :
3368033
Title :
Inspection optimization for excursion and baseline defect monitoring in a manufacturing environment
Author :
Sajoto, D. ; Gordon, Aaron ; McCauley, Aaron
Author_Institution :
Cypress Semicond., Bloomington, MN, USA
fYear :
1999
fDate :
1999
Firstpage :
371
Lastpage :
374
Abstract :
This paper proposes a methodology for inspection optimization by utilizing correlation results between in-line defect to end-of-line bit failure, demonstrates its advantages, and shows how to achieve balance between the effectiveness and the efficiency of in-line defect inspection
Keywords :
circuit optimisation; failure analysis; inspection; integrated circuit manufacture; process monitoring; baseline defect monitoring; end-of-line bit failure; excursion monitoring; in-line defect; inspection optimization; manufacturing environment; Condition monitoring; Delay; Failure analysis; Inspection; Optimization methods; Process control; Pulp manufacturing; Semiconductor device manufacture; Signal to noise ratio; Time to market;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Conference_Location :
Santa Clara, CA
ISSN :
1523-553X
Print_ISBN :
0-7803-5403-6
Type :
conf
DOI :
10.1109/ISSM.1999.808813
Filename :
808813
Link To Document :
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