Automatic monitoring and analysis of engineering experiments

Author

Beal, Glade ; Moller, Steven

Author_Institution

Nat. Semicond. Corp., Annapolis Junction, MA, USA

fYear

1999

fDate

1999

Firstpage

423

Lastpage

426

Abstract

Yield and process improvement experiments generate enormous amounts of data that need to be analyzed. The sheer volume of data tends to overwhelm even the most enthusiastic engineer. A “hands-off” analysis routine that did all the number crunching for them was needed. This paper describes a program that runs in the background, analyzing experimental results using a stepwise regression technique that tests for multivariate effects and a nonparametric analysis of variance. It produces and stores an array of charts and summaries in a standard format for review by any one in the engineering staff

Keywords

integrated circuit yield; nonparametric statistics; process monitoring; statistical analysis; multivariate effects; nonparametric analysis; process improvement experiments; standard format; stepwise regression technique; yield improvement experiments; Analysis of variance; Computerized monitoring; Data analysis; Data engineering; Design engineering; Design for experiments; Information analysis; Phased arrays; Statistical analysis; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on

Conference_Location

Santa Clara, CA

ISSN

1523-553X

Print_ISBN

0-7803-5403-6

Type

conf

DOI

10.1109/ISSM.1999.808826

Filename

808826