Crosstalk analysis of multisection multiconductor lines

Author

Su, Wansheng ; Riad, Sedki M. ; Elshabini-Riad, Aicha ; Poulin, Thomas

Author_Institution

Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

fYear

1992

fDate

12-14 May 1992

Firstpage

142

Lastpage

146

Abstract

The authors report on a method for crosstalk characterization and modeling of multisection, multiconductor transmission lines, such as in the case of tape automated bonding (TAB) packages. The method uses field analysis software packages to calculate the electrical parameters of the TAB lines´ sections. These parameters are then used to establish a model for the multisection, multiconductor structure. Using this model, lines´ coupling behavior (crosstalk) can be predicted. A time-domain measurement for a section of a TAB structure is provided in order to demonstrate the modeling concept. Corresponding predicted crosstalk waveforms are also presented

Keywords

automatic test equipment; computer aided analysis; coupled circuits; crosstalk; equivalent circuits; tape automated bonding; transmission lines; waveform analysis; coupling; crosstalk; electrical parameters; field analysis software packages; modeling; multisection multiconductor lines; prediction; tape automated bonding; time-domain measurement; waveforms; Bonding; Conductors; Coupling circuits; Crosstalk; Electronics packaging; Integrated circuit interconnections; Multiconductor transmission lines; Probes; Semiconductor device packaging; Time measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Instrumentation and Measurement Technology Conference, 1992. IMTC '92., 9th IEEE

Conference_Location

Metropolitan, NY

Print_ISBN

0-7803-0640-6

Type

conf

DOI

10.1109/IMTC.1992.245161

Filename

245161