• DocumentCode
    3369424
  • Title

    Effect of shield insertion on reducing crosstalk noise between coupled interconnects

  • Author

    Zhang, Junmou ; Friedman, Eby G.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    23-26 May 2004
  • Abstract
    Placing shields around a victim signal line is a common way to enhance signal integrity while minimizing delay uncertainty. For two coupled interconnects with a shield between the lines, the coupling noise can produce a peak noise of 15% of Vdd in a 0.18 μm CMOS technology. A pseudo-2π RC model is used to develop an analytic estimate of the peak noise for shielded interconnects. The peak noise model is accurate within an average error of 4.4% as compared to SPICE. The effects of the shield width, length, separation between the shield and the signal, and the number of connections tieing the shield to ground on the overall crosstalk noise are described in this paper. Based on the peak noise model, a minimum number of ground connections for a target shield line with noise constraints is obtained. Inserting a shield line between two coupled interconnects is shown to be more effective in reducing crosstalk noise than increasing the physical separation.
  • Keywords
    CMOS integrated circuits; crosstalk; delay circuits; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; 0.18 micron; CMOS technology; SPICE; coupled interconnects; coupling noise; crosstalk noise; delay uncertainty; enhance signal integrity; peak noise model; physical separation; shield insertion effects; shielded interconnects; Capacitance; Circuit noise; Coupling circuits; Crosstalk; Equivalent circuits; Integrated circuit interconnections; Noise reduction; Switches; Switching circuits; Transfer functions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2004. ISCAS '04. Proceedings of the 2004 International Symposium on
  • Print_ISBN
    0-7803-8251-X
  • Type

    conf

  • DOI
    10.1109/ISCAS.2004.1329325
  • Filename
    1329325