• DocumentCode
    3369897
  • Title

    A new kind of microstructures applied to Closed Loop Thermosyphons

  • Author

    Dashi, Su ; Yajun, Liu ; Wei, Zhou

  • Author_Institution
    Sch. of Mech. Eng., Shaoguan Univ., Shaoguan, China
  • fYear
    2009
  • fDate
    9-12 Aug. 2009
  • Firstpage
    2167
  • Lastpage
    2172
  • Abstract
    Three kinds of Enhanced Boiling Microstructures(EBMS) were fabricated. A series of pool boiling experiments were carried out to estimate the performance of all kinds of EBMS. According to the results of pool boiling experiments, the best EBMS, which have the lowest wall superheat and highest Critical Heat Flux (CHF), was chosen as the most important part of a new designed Two-phase Closed Loop Thermosyphons(TCLT). The aim of the TCLT is to dissipate high heat flux of some electronic devices. The TCLT was composed of an evaporator, a condenser, a subcooler and connecting tubes. A series of dissipating heat experiments of the TCLT were carried out. Results show that thermal resistance of the TCLT can reach minimum value 0.077°C/W, and the highest heat flux that the TCLT can transfer is 44.2W/cm2 when pure water is the working fluid.
  • Keywords
    condensation; cooling; evaporation; microfabrication; micromechanical devices; micromechanics; thermal resistance; EBMS fabrication; TCLT; condenser; critical heat flux; enhanced boiling microstructures; evaporator; heat dissipation; subcooler; thermal resistance; two-phase closed loop thermosyphons; Central Processing Unit; Cooling; Copper; Heat transfer; Microchannel; Microstructure; Resistance heating; Surface discharges; Surface resistance; Thermal resistance; Enhanced boiling; Microstructure; Thermosyphon; Two-phase heat transfer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Automation, 2009. ICMA 2009. International Conference on
  • Conference_Location
    Changchun
  • Print_ISBN
    978-1-4244-2692-8
  • Electronic_ISBN
    978-1-4244-2693-5
  • Type

    conf

  • DOI
    10.1109/ICMA.2009.5246546
  • Filename
    5246546