Analog front-end design implementation of USB2.0 OTG Attach Detection Protocol

Author

Lun, Chia Chong ; Bin Marzuki, Arjuna ; Wei, Su Hsiao

Author_Institution

Sch. of Electr. & Electron. Eng., Univ. Sains Malaysia (USM), Minden, Malaysia

Volume

2

fYear

2012

fDate

12-14 June 2012

Firstpage

774

Lastpage

779

Abstract

This paper presents a design solution for the Attach Detection Protocol under USB2.0 On-The-Go (OTG) Specification released by the USB Organization in year 2010. The implementation of ADP can be divided into-two categories, namely Analog and Digital Front-End. In this paper, analog front-end design will be more focused. This including circuit implementation, PVT variation, simulation result as well as future work will be described in detailed while the overall system overview will still be discussed for a clearer picture. This system uses supply voltage of 1.8V, 45nm CMOS process technology with PVT of ±10% supply variation, -40°C to 110°C temperature variation and 13 process corners.

Keywords

CMOS analogue integrated circuits; field buses; integrated circuit design; protocols; ADP implementation; CMOS process technology; PVT variation; USB2.0 OTG attach detection protocol; analog front-end design implementation; circuit implementation; on-the-go specification; size 45 nm; temperature -40 degC to 110 degC; voltage 1.8 V; Discharges (electric); Fault location; Protocols; Simulation; Transistors; Universal Serial Bus; Attach Detection Protocol (ADP); USB2.0 On-The-Go (OTG);

fLanguage

English

Publisher

ieee

Conference_Titel

Intelligent and Advanced Systems (ICIAS), 2012 4th International Conference on

Conference_Location

Kuala Lumpur

Print_ISBN

978-1-4577-1968-4

Type

conf

DOI

10.1109/ICIAS.2012.6306118

Filename

6306118