• DocumentCode
    3370267
  • Title

    Soft error modeling, simulation, and testing at advanced technology nodes

  • Author

    Bhuva, B.L. ; Holman, W.T. ; Massengill, L.W.

  • Author_Institution
    Vanderbilt Univ., Nashville, TN, USA
  • fYear
    2011
  • fDate
    2-4 May 2011
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    As feature sizes decrease, soft errors are expected to become the dominant failure mechanisms for integrated circuits. This paper discusses the challenges that design and reliability engineers will face with the manufacture and test of ICs at advanced technology nodes.
  • Keywords
    integrated circuit manufacture; integrated circuit testing; radiation hardening (electronics); IC manufacture; IC test; advanced technology nodes; soft error modeling; Fabrication; Failure analysis; Integrated circuit modeling; Neutrons; Silicon; IC design; Soft errors; alpha particles; neutrons; testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IC Design & Technology (ICICDT), 2011 IEEE International Conference on
  • Conference_Location
    Kaohsiung
  • ISSN
    Pending
  • Print_ISBN
    978-1-4244-9019-6
  • Type

    conf

  • DOI
    10.1109/ICICDT.2011.5783237
  • Filename
    5783237
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3370267