A design of transition between microstrip line and semiconductor devices with gold-bonding wire

Gold-bonding wires have been frequently used in connecting semiconductor devices and microstrip lines. This paper presents a design of transition between microstrip line and semiconductor device with gold-bonding wire. As the material and shape of the loop has already been discussed in other researches, this paper concentrates on the positions of the solders and the height of the chip. The results of the simulations indicate that if the solders locate beside the edge of the microstrip line, and the height of chip is appropriate designed, less insertion loss can be expected.