DocumentCode
3372518
Title
Capacitor dendrite failure analysis for lidless CPU testing
Author
Weidong, Huang ; Changhong, Yu ; Cimi, Cui ; Zuo, Deshan ; Hongwei, Guo ; Xie, Chao ; Majed, Anani
Author_Institution
AMD Technol. (China) Co., Ltd., Suzhou, China
fYear
2012
fDate
2-6 July 2012
Firstpage
1
Lastpage
4
Abstract
One lidless CPU product failed more than 20% of visual inspections due to foreign material near the capacitor electrodes during testing production. This paper presents the analysis method for the foreign material, formation mechanism of dendrites, verification experiment by DOE, root cause for this case, and corrective solutions.
Keywords
capacitors; dendrites; design of experiments; electrodes; electron device testing; electronics packaging; failure analysis; DOE; capacitor dendrite failure analysis; capacitor electrodes; design of experiment; foreign material; lidless package CPU testing; testing production; visual inspections; Capacitors; Central Processing Unit; Electrodes; Humidity; Materials; Production; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location
Singapore
ISSN
1946-1542
Print_ISBN
978-1-4673-0980-6
Type
conf
DOI
10.1109/IPFA.2012.6306253
Filename
6306253
Link To Document