• DocumentCode
    3372535
  • Title

    Local current measurements for avalanche breakdown in Silicon p-n junctions

  • Author

    Ding, Y. ; Poenar, D.P. ; Isakov, D.V.

  • Author_Institution
    Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2012
  • fDate
    2-6 July 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Application of Photon Emission Microscopy (PEM) in semiconductor characterization often shows a linear dependence between emission intensity and biasing current. However, inconclusive understanding of photon emission phenomena in Silicon stopped the research community form applying PEM for local current estimation. In this paper we show for the first time that the linear relationship is valid for avalanche breakdown in the range of currents across five orders of magnitude. And we conclude that the observed relationship is independent of non-radiative effects. Using the observed photon emission pattern we perform a detailed analysis of the influence of the junction geometry and doping topology on the breakdown phenomenon. We also for the first time estimate the local I-V curves in the junction and demonstrate the complexity of the breakdown phenomenon. Our results also demonstrate a poor applicability of global I-V curve measurements for calibration of existing TCAD models.
  • Keywords
    avalanche breakdown; electric current measurement; geometry; network topology; p-n junctions; semiconductor doping; technology CAD (electronics); I-V curves; PEM; TCAD models; avalanche breakdown; doping topology; junction geometry; local current estimation; local current measurements; photon emission microscopy; semiconductor characterization; silicon p-n junctions; Avalanche breakdown; Current measurement; Doping; Junctions; Photonics; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
  • Conference_Location
    Singapore
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4673-0980-6
  • Type

    conf

  • DOI
    10.1109/IPFA.2012.6306254
  • Filename
    6306254