• DocumentCode
    337255
  • Title

    Experimental studies of indentor misalignment for indentation test on soft tissues

  • Author

    Zheng, Y.P. ; Huang, D.T. ; Mak, A.F.T.

  • Author_Institution
    Rehabilitation Eng. Center, Hong Kong Polytech., Hong Kong
  • Volume
    5
  • fYear
    1997
  • fDate
    1997
  • Firstpage
    2250
  • Abstract
    Effects of indentor misalignment of skin indentation test were investigated numerically using finite element analysis and experimentally on soft tissues in vitro using an ultrasound indentation apparatus. Earlier numerical results showed the stress distribution was significantly influenced by the misalignment, but the resultant force transient of the indentation response only was slightly affected by the indentor misalignment. Experimental results demonstrated the indentation responses could be influenced by the misalignment, especially when tissue thickness was comparable to the indentor diameter. This effect decreased as the thickness increased, and became almost negligible while the thickness was larger than double of the indentor diameter. The effects due to misalignment could also be significantly reduced by adopting some amount of pre-load. The amplitude of the ultrasound signal reflected from the bottom interface of the tissue obviously decreased as the misalignment degree increased, while the time shift of the signal increased slightly
  • Keywords
    biomechanics; biomedical measurement; biomedical ultrasonics; finite element analysis; indentation; skin; US indentation test; biomechanics; finite element analysis; force transient; indentor misalignment; signal time shift; skin indentation test; soft tissues; stress distribution; tissue thickness; tissues in vitro; Biological materials; Biological tissues; Bones; Finite element methods; In vivo; Probes; Punching; Skin; Testing; Ultrasonic imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-4262-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.1997.758808
  • Filename
    758808