• DocumentCode
    337263
  • Title

    Micromachined pipette arrays (MPA)

  • Author

    Papautsky, Ian E. ; Brazzle, John D. ; Swerdlow, Harold ; Frazier, A. Bruno

  • Author_Institution
    Dept. of Bioeng., Utah Univ., Salt Lake City, UT, USA
  • Volume
    5
  • fYear
    1997
  • fDate
    1997
  • Firstpage
    2281
  • Abstract
    The design and biocompatibility testing of batch fabricated micromachined pipette arrays is described. The process used to fabricate the metallic micromachined pipette arrays (MPA) includes p+ etch-stop membrane technology, anisotropic etching of silicon in potassium hydroxide, sacrificial thick photoresist micromolding technology, and micro electroforming technology. Arrays of one to ten pipettes have been fabricated using nickel as the structural material and gold as the biocompatible coating of inside walls. The inner dimensions of the individual pipettes fabricated to date range from 30 μm to 1.5 mm in width, 0.5 mm to several cm in length, and 5 μm to 50 μm in thickness. The micromachined pipettes have many advantages over current micro pipette technology, including: (a) highly parallel manipulation of samples/reagents, (b) the capability to precisely define the pipette dimensions allowing for small volumes (in pL to μL range), and (c) a wide range of pipette center-to-center spacings (from centimeters to approximately 20 μm)
  • Keywords
    arrays; biomedical equipment; micromachining; 5 to 30 mum; Au; KOH; Ni; Si; anisotropic etching; biocompatibility testing; biological analysis; design; highly parallel manipulation; micromachined pipette arrays; micropipette technology; p+ etch-stop membrane technology; pipette dimensions precise definition; reagents; samples; Anisotropic magnetoresistance; Biological materials; Biomembranes; Coatings; Etching; Gold; Nickel; Resists; Silicon; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1997. Proceedings of the 19th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-4262-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.1997.758817
  • Filename
    758817