Title :
Comparison of three methods to measure the internal pressure of empty MEMS packages
Author :
Wang, B. ; Tanaka, S. ; De Coster, J. ; Severi, Simone ; Witvrouw, A. ; Wevers, M. ; De Wolf, I.
Author_Institution :
imec, Leuven, Belgium
Abstract :
Three different measurement methods for the measurement of the pressure inside empty MEMS packages are demonstrated and discussed. They are based on measurements of capacitance, cap resonance or cap buckling. The capacitance measurement method is shown to be the most sensitive of the three methods for this application, with a pressure resolution of 11mbar.
Keywords :
capacitance measurement; micromechanical devices; cap buckling; cap resonance; capacitance measurement method; empty MEMS package; internal pressure; Capacitance; Capacitance measurement; Frequency measurement; Micromechanical devices; Packaging; Pressure measurement; Resonant frequency;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-0980-6
DOI :
10.1109/IPFA.2012.6306268
