DocumentCode
3373083
Title
IGBT Stacks Based Pulse Power Generator for PIII&D
Author
Kim, J.H. ; Park, C.G. ; Ryoo, M.H. ; Shenderey, S. ; Kim, J.S. ; Rim, G.H.
Author_Institution
Korea Electrotechnol. Res. Inst., Changwon
fYear
2005
fDate
13-17 June 2005
Firstpage
1065
Lastpage
1068
Abstract
Plasma source ion implantation and deposition (PSII&D) is an emerging technology for surface treatment of metal and polymer materials. Through this technology it is possible to improve surface properties of the materials such as metals, plastics and ceramics. In this study, IGBT stacks based pulse power generator for PSII&D is proposed. The pulse generator uses six IGBT stacks and a step-up pulse transformer to generate high voltage pulse. Twelve IGBTs are connected in series in each IGBT to increase voltage rating of the pulse generator. Each IGBT stack uses a very simple driving method that has only two active drivers and eleven passive drivers (are composed of passive components such as resistors, capacitors, and diodes). Fault detection and fast protection are critical parts of the pulse power generator. The arc generation in the plasma load is common. Due to the arc in the plasma load, short current (overcurrent) condition is often generated. So the overcurrent detection and fast protection is implemented to protect pulse power generator in this paper.
Keywords
insulated gate bipolar transistors; plasma devices; plasma immersion ion implantation; pulsed power technology; IGBT stacks; arc generation; metal surface treatment; plasma load; plasma source ion implantation and deposition; polymer materials surface treatment; pulse power generator; Inorganic materials; Insulated gate bipolar transistors; Ion implantation; Plasma immersion ion implantation; Plasma sources; Power generation; Protection; Pulse generation; Pulse transformers; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Pulsed Power Conference, 2005 IEEE
Conference_Location
Monterey, CA
Print_ISBN
0-7803-9189-6
Electronic_ISBN
0-7803-9190-x
Type
conf
DOI
10.1109/PPC.2005.300503
Filename
4084405
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