DocumentCode
3373335
Title
Operational and manufacturing environment CE validation tools
Author
Sellars, Andy
Author_Institution
Pacific Numerix Corp., La Jolla, CA, USA
fYear
1992
fDate
1992
Firstpage
103
Lastpage
107
Abstract
The vast majority of failures in electronic systems are due to thermal and vibration stresses. Major improvements in product reliability can be attained by validating the printed circuit board assembly (PCBA) design with respect to the thermal and vibration/shock environments in operation, manufacturing, and test. This PCBA design validation is accomplished with application-specific finite element analysis tools developed by Pacific Numerix Corporation, linked with common CAE/CAD tools in a PCBA level concurrent engineering (CE) system. Also included in this CE system is the capability to validate the PCBA design with respect to electromagnetic parasitics. Designs can be validated before the printed circuit board (PCB) is fabricated and assembled, resulting in a more reliable product, reduced quality costs and reduced product development cycle time. Communication inadequacies between various engineering disciplines and between engineering, manufacturing, and test is one of the major obstacles to concurrent engineering that is improved with this PCBA CE system
Keywords
circuit analysis computing; concurrent engineering; finite element analysis; printed circuit design; printed circuit manufacture; FEA system; PCBA CE system; PCBA design validation; PCBA level concurrent engineering system; application-specific finite element analysis tools; common CAE/CAD tools; communication inadequacies; electromagnetic parasitics; electronic systems; engineering disciplines; manufacturing environment CE validation tools; printed circuit board assembly design; product development cycle time; product reliability; thermal analysis; vibration stresses; vibration/shock environments; Assembly; Circuit testing; Computer aided engineering; Concurrent engineering; Electric shock; Finite element methods; Manufacturing; Printed circuits; Reliability engineering; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability and Maintainability Computer-Aided Engineering in Concurrent Engineering, 1990 and 1991., Combined Proceedings of the 1990 and 1991 Leesburg Workshops on
Conference_Location
Leesburg, VA ; Ellicott City, MD
Type
conf
DOI
10.1109/RMCAE.1992.245505
Filename
245505
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