DocumentCode
3374375
Title
Verification structures for transmission line pulse measurements
Author
Ashton, R.A.
Author_Institution
Agere Syst., Orlando, FL, USA
fYear
2002
fDate
8-11 April 2002
Firstpage
169
Lastpage
173
Abstract
Test structures intended for performance verification of transmission line pulse (TLP) systems have been designed and tested. They consist of simple resistors in either copper or silicide clad polysilicon. The copper structures proved unsuitable due to excess heating and melting of any reasonable geometry. The silicide clad polysilicon proved more successful. A simple model of resistive heating accounts for observed non-linearity in the structures under high current stress.
Keywords
pulse measurement; resistors; transmission lines; Cu; copper resistor; resistive heating; silicide clad polysilicon resistor; test structure; transmission line pulse measurement; verification structure; Breakdown voltage; Circuits; Electrical resistance measurement; Electrostatic discharge; Impedance; Pulse measurements; Resistors; Semiconductor device measurement; System testing; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 2002. ICMTS 2002. Proceedings of the 2002 International Conference on
Print_ISBN
0-7803-7464-9
Type
conf
DOI
10.1109/ICMTS.2002.1193191
Filename
1193191
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