DocumentCode :
3374397
Title :
Direct measurement of field transistor threshold voltages using inversion layer fed transistors in deep submicron processes
Author :
Ellis, John N.
Author_Institution :
Zarlink Semicond., Plymouth, UK
fYear :
2002
fDate :
8-11 April 2002
Firstpage :
175
Lastpage :
178
Abstract :
Polysilicon field transistors are traditionally overlapped onto thin oxide regions to connect to the source and drain of a transistor. Submicron processes have gate oxides with breakdown voltages below the field threshold and the traditional layout is not suitable. It is however necessary to maintain a channel to the source and drain, but this can be accomplished using a field plate device. By placing a metal gate over the poly gate, and biasing the metal gate into strong inversion, it is possible for the polysilicon gate to control the transistor current. In fact with this one structure both the polysilicon and metal field threshold voltages can be ascertained.
Keywords :
MOSFET; inversion layers; semiconductor device breakdown; semiconductor device measurement; voltage measurement; breakdown voltages; classical MOSFET equation; deep submicron CMOS processes; direct measurement; field plate device; field transistor threshold voltages; gate oxides; inversion layer fed transistors; metal gate; poly gate; polysilicon field transistors; thin oxide regions; transistor current control; Area measurement; Joining processes; MOS devices; Power supplies; Testing; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 2002. ICMTS 2002. Proceedings of the 2002 International Conference on
Print_ISBN :
0-7803-7464-9
Type :
conf
DOI :
10.1109/ICMTS.2002.1193192
Filename :
1193192
Link To Document :
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